亚洲综合色区另类AV-亚洲综合色区另类AⅤ-无码专区亚洲综合另类-另类亚洲综合区图片小说区

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          Underfill

          Location:Home > Products > Underfill > Text
          The underfill adhesive is one compnent,low viscosity,low tenperature heat curing. It has excellent electrical properties, weather resistance, and chemical resistance.

          Mainly be used in phone/touch screen/PDA/computer motherboard industry,has excellent structural bonding effect.
          Technical Date Sheet


          Product
          Number

          Color

          Viscosity
          (mPa.s)

          Tg℃

          Whether Can Repair

          The curing conditions
          Minutes / temperature

          (Mpa)Shear Strength

          packing

          Product Application

          JLD-5351

          Black

          375

          69

          yes

          15/120
          10/130

          5

          30ML
          50ML

          CSP,BGA universal,low viscosity,Good liquidity,flowing in room temperature,good permeability,easy to repair.

          JLD-5352

          Black

          1800

          53

          yes

          5/120
          2/130

          8

          30ML
          50ML

          CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

          JLD-5354

          Brown

          4300

          110

          no

          15/120
          30/130

          10

          30ML
          50ML

          CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

          JLD-5354

          Black

          360

          113

          no

          15/120
          10/130

          6

          30ML
          50ML

          CSP,BGA universal,low viscosity,good liquidity,flowing in room temperature.It is used in mobile electronic component adhesive filling .

          JLD-5355

          Opal

          4500

          68

          no

          15/120
          12/150
          30/100

          8

          30ML
          50ML
          250ML

          CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

           Notice: Underfill adhesive can be customized.

          Update Time:2014-03-31 16:25:25Hit:6124Size:T|T
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          亚洲综合色区另类AV-亚洲综合色区另类AⅤ-无码专区亚洲综合另类-另类亚洲综合区图片小说区